Slicing Technology Services
ESG - Cropping & Wafering
Easy cropping and wafering
This ESG-Series diamond wire saws are specially developed for cutting mono-crystalline silicon. Equipped with four pulleys and offering multiple adjustable speeds to meet your diverse cutting needs.
The equipment is in four different standard sizes available.
- ESG250-4T for 8-10"
- ESG350-4T for 10-12"
- ESG450-4T for 18"
- ESG600-4T for 24"
For cutting mono-crystalline silicon, optical glass, sapphire, ceramics, magnetic materials, metals, crystals, graphite, meteorites, corrugated cardboard and other hard and brittle materials.
What you get
- Excellent cutting quality
- Low acquisition costs
- Simple maintenance
- Short lead time
- 12 months quality warranty on machines
- Free trial cutting services
- Worldwide support from experienced and competent staff
Characteristics
- Simple and intuitive operation via touchscreen
- Multiple adjustable speeds during the same cut
- Fast linear speed and high cutting efficiency
- Edge chipping ≤5mm
- 2-axis control (vertical feed, horizontal loading table)
- 4 pulleys with 3 wire grooves each for longer use and shorter down time
- Observation of the process through 2 front doors
- Display of the process status via LED light
- Simple wire tension system
- Simple and quick wire installation / wire change (within a few minutes!)
- Short down time thanks to simple operation
- Tank for coolant on rollers
Technical parameters
Details of the technical parameters of the ESG250-4T. The parameters vary depending on the machine version. Contact us for further information.
Connection voltage
220 VAC
Total power
2.4 kW
Machine size
1900 × 1420 × 2080 mm (L×W×H)
Total weight
1250 kg
Loading table load capacity
300 kg
Drive type
Servo
Servo motor power
1000 W
Feed speed
0.01-1000mm/min
Max. speed
3000 rpm
Cutting thickness
0.1-250 mm (adjustable)
Max. workpiece size
1500 × 210 × 210 mm (L×W×H)
Max. linear speed
32 m/s
Water tank capacity
180 l